lucadelladora – A new die shot of the MediaTek Dimensity 9500 system-on-chip (SoC) has surfaced online, revealing key hardware upgrades. Posted by semiconductor teardown expert KurnalSalts on X, the image compares the Dimensity 9500 to its predecessor, the Dimensity 9400. The new flagship chip measures approximately 140.79 mm², a noticeable increase over the 9400’s ~126.26 mm² footprint.
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This size increase also places the Dimensity 9500 ahead of Qualcomm’s Snapdragon 8 Elite Gen 5, which has a similar die area of about 126 mm². The added space likely accommodates performance enhancements that MediaTek could not achieve through a node transition alone, from TSMC’s N3E to N3P process.
Despite the larger size, MediaTek has retained its all-performance-core (P-core) CPU design. The CPU cluster layout remains unchanged, with the highest-performing core positioned at the bottom right. However, the L2 cache has increased to 16 MiB, up from 12 MiB in the Dimensity 9400, enabling faster data access and improved multitasking.
The die shot also shows changes to the 5G modem layout, which is now more compact. This space-saving move allows MediaTek to expand other key areas like the image signal processor (ISP) and video processing unit. These enhancements signal a focus on boosting media capabilities, especially for premium-tier smartphones.
AI and Graphics Improvements Suggest MediaTek’s Long-Term Strategy
One of the most noticeable changes in the Dimensity 9500 die shot is the expanded neural processing unit (NPU). As demand for on-device AI grows, manufacturers are dedicating more silicon to handle AI-related tasks. MediaTek appears to be following this trend by enlarging the NPU for better support of generative AI, voice processing, and image recognition.
The Mali C1 Ultra GPU also receives a significant upgrade. It now features more cores or compute units (CUs) than the Adreno 840 found in Qualcomm’s latest SoC. This suggests improved performance in gaming, real-time rendering, and high-frame-rate video playback.
Despite the enhancements, the Dimensity 9500 retains a familiar overall design. MediaTek seems to favor incremental upgrades rather than overhauling core architecture. This approach likely ensures better power efficiency and compatibility across a wider range of devices.
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The Dimensity 9500 represents a calculated step forward, bridging current-generation capabilities with next-gen features. It lays the groundwork for the upcoming Dimensity 9600, which has reportedly already taped out on TSMC’s advanced 2 nm N2 process.
With a larger die, more AI muscle, and an upgraded GPU, the Dimensity 9500 positions itself as a strong contender in the premium Android SoC market. These improvements reflect MediaTek’s evolving strategy to challenge Qualcomm’s dominance and meet the increasing demands of modern mobile computing.
